Prediction of thermo-mechanical integrity of wafer backend processes

V Gonda, JMJ den Toonder, J Beijer, GQ Zhang, WD van Driel, ROJM Hoofman, LJ Ernst

Research output: Contribution to journalArticleScientificpeer-review

14 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)2011-2017
Number of pages7
JournalMicroelectronics Reliability
Publication statusPublished - 2004


  • ZX CWTS JFIS < 1.00

Cite this