Prediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints

V. Thukral, Aniket Bharamgonda*, Idowu Olatunji, Xiao Lin, Abhijit Dasgupta, Torsten Hauck, Yaxiong Chen

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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Abstract

SnAgCu solder joint has oligocrystalline (few large grains) structure and due to body-centered tetragonal (BCT) structure, each grain shows strongly anisotropic behavior. Modelling anisotropic behavior of grain scale solder joints has been extensively researched by this group. In this paper, anisotropic grain-scale plasticity model is used to predict variability of solder joint fatigue durability under sine sweep vibration excitation. Solder experiences different levels of cyclic stress for different grain orientations. Stress-based high cycle fatigue (HCF) model (Basquin’s model) and Miner’s rule are used for determining the variability of vibration durability of solder joints for different orientations and compared with experimental results.
Original languageEnglish
Title of host publicationPrediction of Variability in Vibration Durability of Oligocrystalline SnAgCu Solder Joints
Place of PublicationCatania, Italy
PublisherIEEE
Number of pages5
ISBN (Electronic)979-8-3503-9363-7
ISBN (Print)979-8-3503-9364-4
DOIs
Publication statusPublished - 2024
Event2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Catania, Italy
Duration: 7 Apr 202410 Apr 2024
Conference number: 25th

Conference

Conference2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Abbreviated titleEuriSimE 2024
Country/TerritoryItaly
CityCatania
Period7/04/2410/04/24

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