Preliminary MW and MMW reflection and transmission measurements of a silicon wafer under illumination of light for reflected phased array antennas

M Hajian, LP Ligthart

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Abstract

    At microwave frequencies, the antenna beam scanning is commonly realized using phased array antennas. Such approach is expensive and very time consuming. As the frequency increases into the millimeter region, the complexity and the cost makes the realization of phased array antenna even more complex, less desirable and very difficult. A preliminary study of oimplementing a low weight and a low cost antenna at Millimeter wave (MMW) frequency that can form and scan a beam is done. the antenna uses a semiconductor body, a MMW - and optical source. The optical source illuminates the semiconductor. In the seimiconductor body the spatially varying density of charge carriers changes the relative dielectric constant of the semiconductor.In the semiconductor body the spatially varying density of charge carriers changes the relative dielectric constant of the semiconductor, such that it can reflect or transmit incident field from MMW source. Since the projection can be realized selectively a beam can be scan in the space.
    Original languageUndefined/Unknown
    Title of host publicationProceedings of the 36th european microwave conference
    Editors s.n.
    Place of PublicationManchester
    PublisherHorizon House
    Pages622-625
    Number of pages4
    ISBN (Print)2960055160
    Publication statusPublished - 2006
    EventProceedings of the 36th european microwave conference - Manchester, United Kingdom
    Duration: 10 Sept 200615 Sept 2006

    Publication series

    Name
    PublisherHorizon House

    Conference

    ConferenceProceedings of the 36th european microwave conference
    Country/TerritoryUnited Kingdom
    CityManchester
    Period10/09/0615/09/06

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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