Pressure-assisted CU sintering for SiC Die-attachment application

Research output: ThesisDissertation (TU Delft)

Original languageEnglish
QualificationDoctor of Philosophy
Awarding Institution
  • Microelectronics
  • Delft University of Technology
Supervisors/Advisors
  • Zhang, G.Q., Supervisor
  • Ye, H., Advisor
Award date30 Jan 2023
Print ISBNs978-94-6473-018-0
DOIs
Publication statusPublished - 2023

Keywords

  • nano Cu sintering
  • Silicon carbide power electronics packaging
  • Shear Strength
  • Mechanical reliability
  • Thermal conductivity
  • Molecular dynamics
  • Static and dynamic test
  • Nanoindentation

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