Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

D Yang, LJ Ernst, KMB Jansen, GQ Zhang, JHJ Janssen, HJL Bressers

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

3 Citations (Scopus)
Original languageUndefined/Unknown
Title of host publicationPolytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics
EditorsA Dziedzic, J Felba
Place of PublicationPiscataway
PublisherIEEE Society
Pages25-29
Number of pages5
ISBN (Print)0-7803-9553-0
Publication statusPublished - 2005
Event5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland - Piscataway
Duration: 23 Oct 200526 Oct 2005

Publication series

Name
PublisherIEEE

Conference

Conference5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland
Period23/10/0526/10/05

Keywords

  • Conf.proc. > 3 pag

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