@inproceedings{3db362ad0b9747139b6a8bbb1f79364c,
title = "Process-induced warpage in HVQFN package: effect of design parameters and processing conditions",
keywords = "Conf.proc. > 3 pag",
author = "D Yang and LJ Ernst and KMB Jansen and GQ Zhang and JHJ Janssen and HJL Bressers",
year = "2005",
language = "Undefined/Unknown",
isbn = "0-7803-9553-0",
publisher = "IEEE Society",
pages = "25--29",
editor = "A Dziedzic and J Felba",
booktitle = "Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics",
note = "5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, Wroclaw, Poland ; Conference date: 23-10-2005 Through 26-10-2005",
}