@inproceedings{2f77993464294b0699063e7d9e76f2c1,
title = "Quality assured disassembly of electronic components for reuse",
keywords = "Conf.proc. > 3 pag",
author = "I Stobbe and H Griese and H P{\"o}tter and H Reichl and L Stobbe",
year = "2002",
language = "Undefined/Unknown",
isbn = "0-7803-7214-X",
publisher = "IEEE",
pages = "299--305",
booktitle = "2002 IEEE international symposium on electronics \& the environment",
address = "United States",
note = "Symposium, San Francisco ; Conference date: 06-05-2002 Through 09-05-2002",
}