QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment

P Deixler; T Letavic; T Mahatdejkul; Y Bouttement; R Brock; PC Tan; V Saikumar; A Rodriguez; R Colclaser; P Keliowan; H Sun; N Bell; D Bower; A Yao; R van Langevelde; T Vanhoucke; WD van Noort; GAM Hurkx; D Crespo; C Biard; S Bardy; JW Slotboom

QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment

P Deixler, T Letavic, T Mahatdejkul, Y Bouttement, R Brock, PC Tan, V Saikumar, A Rodriguez, R Colclaser, P Keliowan, H Sun, N Bell, D Bower, A Yao, R van Langevelde, T Vanhoucke, WD van Noort, GAM Hurkx, D Crespo, C BiardS Bardy, JW Slotboom

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

30 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting
Editors	s.n.
Place of Publication	Santa Barbara, USA
Publisher	Electron Device Society
Pages	272-276
Number of pages	5
ISBN (Print)	0-7803-9309-0
Publication status	Published - 2005
Event	Bipolar/BiCMOS Circuits and Technology Meeting - Santa Barbara, USA Duration: 9 Oct 2005 → 11 Oct 2005

Publication series

Name
Publisher	Electron Device Society

Conference

Conference	Bipolar/BiCMOS Circuits and Technology Meeting
Period	9/10/05 → 11/10/05

Bibliographical note

NEO

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

Deixler, P., Letavic, T., Mahatdejkul, T., Bouttement, Y., Brock, R., Tan, PC., Saikumar, V., Rodriguez, A., Colclaser, R., Keliowan, P., Sun, H., Bell, N., Bower, D., Yao, A., van Langevelde, R., Vanhoucke, T., van Noort, WD., Hurkx, GAM., Crespo, D., ... Slotboom, JW. (2005). QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment. In s.n. (Ed.), Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting (pp. 272-276). Electron Device Society.

@inproceedings{036d4f47787e4de6a07b96b1b85d6d38,

title = "QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "P Deixler and T Letavic and T Mahatdejkul and Y Bouttement and R Brock and PC Tan and V Saikumar and A Rodriguez and R Colclaser and P Keliowan and H Sun and N Bell and D Bower and A Yao and {van Langevelde}, R and T Vanhoucke and {van Noort}, WD and GAM Hurkx and D Crespo and C Biard and S Bardy and JW Slotboom",

note = "NEO; Bipolar/BiCMOS Circuits and Technology Meeting ; Conference date: 09-10-2005 Through 11-10-2005",

year = "2005",

language = "Undefined/Unknown",

isbn = "0-7803-9309-0",

publisher = "Electron Device Society",

pages = "272--276",

editor = "s.n.",

booktitle = "Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting",

}

Deixler, P, Letavic, T, Mahatdejkul, T, Bouttement, Y, Brock, R, Tan, PC, Saikumar, V, Rodriguez, A, Colclaser, R, Keliowan, P, Sun, H, Bell, N, Bower, D, Yao, A, van Langevelde, R, Vanhoucke, T, van Noort, WD, Hurkx, GAM, Crespo, D, Biard, C, Bardy, S & Slotboom, JW 2005, QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment. in s.n. (ed.), Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting. Electron Device Society, Santa Barbara, USA, pp. 272-276, Bipolar/BiCMOS Circuits and Technology Meeting, 9/10/05.

QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment. / Deixler, P; Letavic, T; Mahatdejkul, T et al.
Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting. ed. / s.n. Santa Barbara, USA: Electron Device Society, 2005. p. 272-276.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment

AU - Deixler, P

AU - Letavic, T

AU - Mahatdejkul, T

AU - Bouttement, Y

AU - Brock, R

AU - Tan, PC

AU - Saikumar, V

AU - Rodriguez, A

AU - Colclaser, R

AU - Keliowan, P

AU - Sun, H

AU - Bell, N

AU - Bower, D

AU - Yao, A

AU - van Langevelde, R

AU - Vanhoucke, T

AU - van Noort, WD

AU - Hurkx, GAM

AU - Crespo, D

AU - Biard, C

AU - Bardy, S

AU - Slotboom, JW

N1 - NEO

PY - 2005

Y1 - 2005

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9309-0

SP - 272

EP - 276

BT - Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting

A2 - s.n., null

PB - Electron Device Society

CY - Santa Barbara, USA

T2 - Bipolar/BiCMOS Circuits and Technology Meeting

Y2 - 9 October 2005 through 11 October 2005

ER -

Deixler P, Letavic T, Mahatdejkul T, Bouttement Y, Brock R, Tan PC et al. QUBiC4plus: A cost-effective BiCMOS manufacturing technology with elite passive enhancements optimized for 'silicon-based' RE-system-in-package environment. In s.n., editor, Proceedings of Bipolar/BiCMOS Circuits and Technology Meeting. Santa Barbara, USA: Electron Device Society. 2005. p. 272-276