@inproceedings{86a83e396e4e43de89e6c0c60ca2da02,
title = "Reduction of transient thermal deformation in a thin plate under moving heat load using thermal modal analysis based control methods",
abstract = "Thermal errors are important sources of positioning errors in precision machines [1] and are more and more becoming determining factors to meet increasing specifications. In this paper, thermal modal analysis is used to study the behaviour of an industrial inkjet printer under thermal load and to develop a reduced order thermal error model while maintaining the precision. The reduction of transient thermal deformation by adding extra heat loads is analysed as a possible method to improve thermal behaviour of high precision printing systems. Two approaches are taken and their simulation results are compared.",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "T Morishima and {van Ostayen}, RAJ and {van Eijk}, J and {Munnig Schmidt}, RH",
year = "2012",
language = "English",
isbn = "978-0-9566790-0-0",
publisher = "EUSPEN",
pages = "448--452",
editor = "P Shore and H Spaan and T Burke",
booktitle = "Proceedings of the 12th international conference of the european society for precision engineering and nanotechnology (euspen), June 4th-7th 2012, Stockholm, Sweden",
note = "12th international conference of the european society for precision engineering and nanotechnology (euspen), Stockholm, Sweden ; Conference date: 04-06-2012 Through 07-06-2012",
}