Reduction of transient thermal deformation in a thin plate under moving heat load using thermal modal analysis based control methods

T Morishima, RAJ van Ostayen, J van Eijk, RH Munnig Schmidt

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)

Abstract

Thermal errors are important sources of positioning errors in precision machines [1] and are more and more becoming determining factors to meet increasing specifications. In this paper, thermal modal analysis is used to study the behaviour of an industrial inkjet printer under thermal load and to develop a reduced order thermal error model while maintaining the precision. The reduction of transient thermal deformation by adding extra heat loads is analysed as a possible method to improve thermal behaviour of high precision printing systems. Two approaches are taken and their simulation results are compared.
Original languageEnglish
Title of host publicationProceedings of the 12th international conference of the european society for precision engineering and nanotechnology (euspen), June 4th-7th 2012, Stockholm, Sweden
EditorsP Shore, H Spaan, T Burke
Place of PublicationStockholm, Sweden
PublisherEUSPEN
Pages448-452
Number of pages5
ISBN (Print)978-0-9566790-0-0
Publication statusPublished - 2012
Event12th international conference of the european society for precision engineering and nanotechnology (euspen), Stockholm, Sweden - Stockholm, Sweden
Duration: 4 Jun 20127 Jun 2012

Publication series

Name
PublisherEuspen
Name
Volume1

Conference

Conference12th international conference of the european society for precision engineering and nanotechnology (euspen), Stockholm, Sweden
Period4/06/127/06/12

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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