Reliability and accelerated test methods for plastic materials in LED-based products

M Yazdan Mehr; WD van Driel; GQ Zhang

doi:10.1109/EuroSimE.2014.6813876

Reliability and accelerated test methods for plastic materials in LED-based products

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Editors	s.n.
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Society
Pages	1-5
Number of pages	5
ISBN (Print)	978-1-4799-4791-1
DOIs	https://doi.org/10.1109/EuroSimE.2014.6813876
Publication status	Published - 2014
Event	EuroSimE 2014: IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Ghent, Belgium Duration: 7 Apr 2014 → 9 Apr 2014

Publication series

Name
Publisher	IEEE

Conference

Conference	EuroSimE 2014
Country/Territory	Belgium
City	Ghent
Period	7/04/14 → 9/04/14

Bibliographical note

Harvest

Access to Document

10.1109/EuroSimE.2014.6813876

Cite this

Yazdan Mehr, M., van Driel, WD., & Zhang, GQ. (2014). Reliability and accelerated test methods for plastic materials in LED-based products. In s.n. (Ed.), Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (pp. 1-5). IEEE Society. https://doi.org/10.1109/EuroSimE.2014.6813876

@inproceedings{d4b4d6a80dc84c53bd1f9b5a09eaf4b8,

title = "Reliability and accelerated test methods for plastic materials in LED-based products",

author = "{Yazdan Mehr}, M and {van Driel}, WD and GQ Zhang",

note = "Harvest; EuroSimE 2014 : IEEE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 07-04-2014 Through 09-04-2014",

year = "2014",

doi = "10.1109/EuroSimE.2014.6813876",

language = "English",

isbn = "978-1-4799-4791-1",

publisher = "IEEE Society",

pages = "1--5",

editor = "s.n.",

booktitle = "Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems",

}

Yazdan Mehr, M , van Driel, WD & Zhang, GQ 2014, Reliability and accelerated test methods for plastic materials in LED-based products. in s.n. (ed.), Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. IEEE Society, Piscataway, NJ, USA, pp. 1-5, EuroSimE 2014, Ghent, Belgium, 7/04/14. https://doi.org/10.1109/EuroSimE.2014.6813876

Reliability and accelerated test methods for plastic materials in LED-based products. / Yazdan Mehr, M ; van Driel, WD ; Zhang, GQ.
Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. ed. / s.n. Piscataway, NJ, USA: IEEE Society, 2014. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Reliability and accelerated test methods for plastic materials in LED-based products

AU - Yazdan Mehr, M

AU - van Driel, WD

AU - Zhang, GQ

N1 - Harvest

PY - 2014

Y1 - 2014

U2 - 10.1109/EuroSimE.2014.6813876

DO - 10.1109/EuroSimE.2014.6813876

M3 - Conference contribution

SN - 978-1-4799-4791-1

SP - 1

EP - 5

BT - Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

A2 - s.n., null

PB - IEEE Society

CY - Piscataway, NJ, USA

T2 - EuroSimE 2014

Y2 - 7 April 2014 through 9 April 2014

ER -

Yazdan Mehr M , van Driel WD , Zhang GQ. Reliability and accelerated test methods for plastic materials in LED-based products. In s.n., editor, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society. 2014. p. 1-5 doi: 10.1109/EuroSimE.2014.6813876