Reliability at the Chip Interfaces: Delaminating the Silicon Die from Molding Compound

G Schlottig

Research output: Thesis › Dissertation (TU Delft, preparation external)

Original language	English
Qualification	Doctor of Philosophy
Awarding Institution	Delft University of Technology
Supervisors/Advisors	Ernst, Leo, Promotor Jansen, K.M.B., Copromotor Zhang, G.Q., Copromotor Dasgupta, A., Copromotor, External person Wunderle, B, Copromotor, External person Yang, DG, Copromotor, External person Pape, H, Copromotor, External person van Keulen, A., Copromotor
Award date	30 Nov 2012
Place of Publication	Enschede
Publisher	Gildeprint
Print ISBNs	978-94-6186-072-9
Publication status	Published - 2012

Keywords

@phdthesis{55df0c275e194d369990e05ed6872a0f,

title = "Reliability at the Chip Interfaces: Delaminating the Silicon Die from Molding Compound",

keywords = "authored books, Diss. prom. aan TU Delft",

author = "G Schlottig",

year = "2012",

language = "English",

isbn = "978-94-6186-072-9",

publisher = "Gildeprint",

type = "Dissertation (TU Delft, preparation external)",

school = "Delft University of Technology",

}