Reliability of LED-based Systems

Willem D.Van Driel, B. Jacobs, P. Watte, X. Zhao

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)
24 Downloads (Pure)

Abstract

Reliability is an essential scientific and technological domain intrinsically linked with system integration. Nowadays, semiconductor industries are confronted with ever-increasing design complexity, dramatically decreasing design margins, increasing chances for and consequences of failures, shortening of product development and qualification time, and increasing difficulties to meet quality, robustness, and reliability requirements. The scientific successes of many micro/nano-related technology developments cannot lead to business success with-out innovation and breakthroughs in the way that we address reliability through the whole value chain. The aim of reliability is to predict, optimize and design upfront the reliability of micro/nanoelectronics and systems, an area denoted as 'Design for Reliability (DfR)'. While virtual schemes based on numerical simulation are widely used for functional design, they lack a systematic approach when used for reliability assessments. Besides this, lifetime predictions are still based on old standards assuming a constant failure rate behavior. In this paper, we will present the reliability and failures found in solid-state lighting systems. It includes both degradation and catastrophic failure modes from observation towards a full description of its mechanism obtained by extensive use of acceleration tests using knowledge-based qualification methods.

Original languageEnglish
Title of host publication2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages4
ISBN (Electronic)9781665413732
DOIs
Publication statusPublished - 2021
Event22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021 - St. Julian, Malta
Duration: 19 Apr 202121 Apr 2021

Publication series

Name2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021

Conference

Conference22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021
Country/TerritoryMalta
CitySt. Julian
Period19/04/2121/04/21

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

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