Reliability Optimization of Gold-Tin Eutectic Die Attach Layer in HEMT Package

Hao Zhang, Jiajie Fan, Jing Zhang, Cheng Qian, Xuejun Fan, Fenglian Sun, G.Q. Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Reliability Optimization of Gold-Tin Eutectic Die Attach Layer in HEMT Package'. Together they form a unique fingerprint.

INIS

Engineering