Reliability study of underfilled flip chip in micro-electronic packaging

X Ma; D Yang; JJ Chen

Reliability study of underfilled flip chip in micro-electronic packaging

X Ma, D Yang, JJ Chen

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, euroSIME2003
Editors	LJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Pages	241-245
Number of pages	5
Publication status	Published - 2003

Keywords

Conf.proc. > 3 pag

Cite this

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title = "Reliability study of underfilled flip chip in micro-electronic packaging",

keywords = "Conf.proc. > 3 pag",

author = "X Ma and D Yang and JJ Chen",

year = "2003",

language = "Undefined/Unknown",

isbn = "0-7803-7054-6",

pages = "241--245",

editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",

booktitle = "Proceedings of the 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, euroSIME2003",

}

Reliability study of underfilled flip chip in micro-electronic packaging. / Ma, X; Yang, D; Chen, JJ.
Proceedings of the 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, euroSIME2003. ed. / LJ Ernst; GQ Zhang; R Dudek; O de Saint Leger. 2003. p. 241-245.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Reliability study of underfilled flip chip in micro-electronic packaging

AU - Ma, X

AU - Yang, D

AU - Chen, JJ

PY - 2003

Y1 - 2003

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-7054-6

SP - 241

EP - 245

BT - Proceedings of the 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, euroSIME2003

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Dudek, R

A2 - de Saint Leger, O

ER -