Reliability study of underfilled flip chip in micro-electronic packaging

X Ma, D Yang, JJ Chen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Original languageUndefined/Unknown
Title of host publicationProceedings of the 4th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, euroSIME2003
EditorsLJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Number of pages5
Publication statusPublished - 2003


  • Conf.proc. > 3 pag

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