Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage

BAZ Mimoun; HTM Pham; V Henneken; R Dekker

doi:10.1116/1.4788795

Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage

BAZ Mimoun, HTM Pham, V Henneken, R Dekker

Electronic Components, Technology and Materials

Research output: Contribution to journal › Article › Scientific › peer-review

23 Citations (Scopus)

Original language	English
Pages (from-to)	1-6
Number of pages	6
Journal	Journal of Vacuum Science and Technology. Part B: Microelectronics and Nanometer Structures
Volume	31
Issue number	2
DOIs	https://doi.org/10.1116/1.4788795
Publication status	Published - 2013

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Harvest
Article number: 021201

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IS - 2

ER -

Residue-free plasma etching of polyimide coatings for small pitch vias with improved step coverage

Bibliographical note

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