Response surface modeling for non-linear packaging stresses

W van Driel; G.Q. Zhang; JW Bergman; G Steenbruggen; LJ Ernst

Response surface modeling for non-linear packaging stresses

W van Driel
, G.Q. Zhang
, JW Bergman
, G Steenbruggen
, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

Original language	Undefined/Unknown
Title of host publication	Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11
Editors	LJ Ernst, de O Saint Leger, GQ Zhang
Place of Publication	Paris
Publisher	Europia
Pages	27-34
Number of pages	8
ISBN (Print)	0-7803-9806-8
Publication status	Published - 2001
Event	EuroSimE 2001 - Paris, France Duration: 9 Apr 2001 → 11 Apr 2001

Publication series

Name
Publisher	Europia

Conference

Conference	EuroSimE 2001
Country/Territory	France
City	Paris
Period	9/04/01 → 11/04/01

Keywords

ZX Int.klas.verslagjaar < 2002

Cite this

@inproceedings{5733f5edd9964be5917807732ec1697f,

title = "Response surface modeling for non-linear packaging stresses",

keywords = "ZX Int.klas.verslagjaar < 2002",

author = "\{van Driel\}, W and G.Q. Zhang and JW Bergman and G Steenbruggen and LJ Ernst",

year = "2001",

language = "Undefined/Unknown",

isbn = "0-7803-9806-8",

publisher = "Europia",

pages = "27--34",

editor = "\{LJ Ernst\} and \{O Saint Leger\}, de and \{GQ Zhang\}",

booktitle = "Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11",

note = "EuroSimE 2001 ; Conference date: 09-04-2001 Through 11-04-2001",

}

van Driel, W, Zhang, GQ, Bergman, JW, Steenbruggen, G & Ernst, LJ 2001, Response surface modeling for non-linear packaging stresses. in LJ Ernst, D O Saint Leger & GQ Zhang (eds), Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. Europia, Paris, pp. 27-34, EuroSimE 2001, Paris, France, 9/04/01.

Response surface modeling for non-linear packaging stresses. / van Driel, W; Zhang, G.Q.; Bergman, JW et al.
Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11. ed. / LJ Ernst; de O Saint Leger; GQ Zhang. Paris: Europia, 2001. p. 27-34.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific

TY - GEN

T1 - Response surface modeling for non-linear packaging stresses

AU - van Driel, W

AU - Zhang, G.Q.

AU - Bergman, JW

AU - Steenbruggen, G

AU - Ernst, LJ

PY - 2001

Y1 - 2001

KW - ZX Int.klas.verslagjaar < 2002

M3 - Conference contribution

SN - 0-7803-9806-8

SP - 27

EP - 34

BT - Proceedings of the 2nd international conference on benefiting from thermal and mechanical simulation in (micro)-electronics, April 9-11

A2 - LJ Ernst, null

A2 - O Saint Leger, de

A2 - GQ Zhang, null

PB - Europia

CY - Paris

T2 - EuroSimE 2001

Y2 - 9 April 2001 through 11 April 2001

ER -