Review of Inorganic Non-metallic Materials in Power Electronics Packaging Application

Power electronics devices, pivotal in advancing electronic system technology, are essential for energy saving, enhancing power control efficiency, reducing noise, and minimizing size and volume. The evolution of power modules is based on innovative packaging structures, technologies, and materials. This paper provides a comprehensive review of inorganic non-metallic packaging materials and technologies in power electronics packaging. It first analyzes the packaging structures and trends of power electronics. The paper then discusses inorganic non-metallic encapsulants such as cement and glass in detail. It also reviews traditional ceramic substrates and elaborates on the advantages of multilayer ceramic technologies, including low-temperature co-fired ceramics (LTCC), as substrates, while looking forward to the commercialization of inorganic composite substrates such as SiCp/Al matrix composites and diamond. Subsequently, the paper overviews inorganic non-metallic fillers for thermal interface materials, emphasizing the application of 2D materials such as graphene and boron nitride (BN), and introduces inorganic non-metallic phase change materials. Finally, it explores the application and future development trends of inorganic non-metallic materials in embedded packaging technologies.