Review of Packaging Schemes for Power Module

Fengze Hou, Wenbo Wang, Liqiang Cao, Jun Li, Meiying Su, Tingyu Lin, Guoqi Zhang, Braham Ferreira*

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

13 Citations (Scopus)
724 Downloads (Pure)

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Engineering & Materials Science