RF-behaviour of anisotropic conductive adhesive in wafer-level packaging for RF-MEMS

J Iannacci, M Bartek

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Abstract

    In this work, an anisotropic conductive adhesive (ACA) used for wafer-level bonding in RF-MEMS packaging is investigated in respect to its influence on RF behaviour of packaged MEMS structures and transmission lines. The packaging solution explored is based on a wafer level packaging (WLP) approach where a capping high-resistivity silicon substrate containing vertical interconnect is adhesively bonded to an RF-MEMS wafer using ACA. After ACA bonding, conductive metal particles within the epoxy based matrix either contribute to the electrical path formation or, when uncompressed, remain isolated. Influence of such isolated particles on RF performance of adjacent structures has been studied using Ansoft HFSS electromagnetic simulator. The results show that the ACA layer might adversely affect performance of RF transmission lines by introducing additional losses. Keywords: ACA, WLP, RF MEMS, hybrid packaging.
    Original languageUndefined/Unknown
    Title of host publication17th MicroMechanics Europe Workshop - Technical Digest
    Editors s.n.
    Place of PublicationSouthampton
    PublisherUniversity of Southampton
    Pages93-96
    Number of pages4
    ISBN (Print)0-85432-848-3
    Publication statusPublished - 2006
    EventThe 17th Micromechanics Europe Workshop, MME'06, Southampton, UK - Southampton U.K
    Duration: 3 Sep 20065 Sep 2006

    Publication series

    Name
    PublisherUniversity of Southampton

    Conference

    ConferenceThe 17th Micromechanics Europe Workshop, MME'06, Southampton, UK
    Period3/09/065/09/06

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

    Cite this

    Iannacci, J., & Bartek, M. (2006). RF-behaviour of anisotropic conductive adhesive in wafer-level packaging for RF-MEMS. In s.n. (Ed.), 17th MicroMechanics Europe Workshop - Technical Digest (pp. 93-96). University of Southampton.