RF-behaviour of anisotropic conductive adhesive in wafer-level packaging for RF-MEMS

J Iannacci; M Bartek

RF-behaviour of anisotropic conductive adhesive in wafer-level packaging for RF-MEMS

J Iannacci, M Bartek

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Abstract

In this work, an anisotropic conductive adhesive (ACA) used for wafer-level bonding in RF-MEMS packaging is investigated in respect to its influence on RF behaviour of packaged MEMS structures and transmission lines. The packaging solution explored is based on a wafer level packaging (WLP) approach where a capping high-resistivity silicon substrate containing vertical interconnect is adhesively bonded to an RF-MEMS wafer using ACA. After ACA bonding, conductive metal particles within the epoxy based matrix either contribute to the electrical path formation or, when uncompressed, remain isolated. Influence of such isolated particles on RF performance of adjacent structures has been studied using Ansoft HFSS electromagnetic simulator. The results show that the ACA layer might adversely affect performance of RF transmission lines by introducing additional losses. Keywords: ACA, WLP, RF MEMS, hybrid packaging.

Original language	Undefined/Unknown
Title of host publication	17th MicroMechanics Europe Workshop - Technical Digest
Editors	s.n.
Place of Publication	Southampton
Publisher	University of Southampton
Pages	93-96
Number of pages	4
ISBN (Print)	0-85432-848-3
Publication status	Published - 2006
Event	The 17th Micromechanics Europe Workshop, MME'06, Southampton, UK - Southampton U.K Duration: 3 Sept 2006 → 5 Sept 2006

Publication series

Name
Publisher	University of Southampton

Conference

Conference	The 17th Micromechanics Europe Workshop, MME'06, Southampton, UK
Period	3/09/06 → 5/09/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{1ccd8c4b998b48278ad55d0f327f51d8,

title = "RF-behaviour of anisotropic conductive adhesive in wafer-level packaging for RF-MEMS",

abstract = "In this work, an anisotropic conductive adhesive (ACA) used for wafer-level bonding in RF-MEMS packaging is investigated in respect to its influence on RF behaviour of packaged MEMS structures and transmission lines. The packaging solution explored is based on a wafer level packaging (WLP) approach where a capping high-resistivity silicon substrate containing vertical interconnect is adhesively bonded to an RF-MEMS wafer using ACA. After ACA bonding, conductive metal particles within the epoxy based matrix either contribute to the electrical path formation or, when uncompressed, remain isolated. Influence of such isolated particles on RF performance of adjacent structures has been studied using Ansoft HFSS electromagnetic simulator. The results show that the ACA layer might adversely affect performance of RF transmission lines by introducing additional losses. Keywords: ACA, WLP, RF MEMS, hybrid packaging.",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J Iannacci and M Bartek",

year = "2006",

language = "Undefined/Unknown",

isbn = "0-85432-848-3",

publisher = "University of Southampton",

pages = "93--96",

editor = "s.n.",

booktitle = "17th MicroMechanics Europe Workshop - Technical Digest",

note = "The 17th Micromechanics Europe Workshop, MME'06, Southampton, UK ; Conference date: 03-09-2006 Through 05-09-2006",

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TY - GEN

T1 - RF-behaviour of anisotropic conductive adhesive in wafer-level packaging for RF-MEMS

AU - Iannacci, J

AU - Bartek, M

PY - 2006

Y1 - 2006

N2 - In this work, an anisotropic conductive adhesive (ACA) used for wafer-level bonding in RF-MEMS packaging is investigated in respect to its influence on RF behaviour of packaged MEMS structures and transmission lines. The packaging solution explored is based on a wafer level packaging (WLP) approach where a capping high-resistivity silicon substrate containing vertical interconnect is adhesively bonded to an RF-MEMS wafer using ACA. After ACA bonding, conductive metal particles within the epoxy based matrix either contribute to the electrical path formation or, when uncompressed, remain isolated. Influence of such isolated particles on RF performance of adjacent structures has been studied using Ansoft HFSS electromagnetic simulator. The results show that the ACA layer might adversely affect performance of RF transmission lines by introducing additional losses. Keywords: ACA, WLP, RF MEMS, hybrid packaging.

AB - In this work, an anisotropic conductive adhesive (ACA) used for wafer-level bonding in RF-MEMS packaging is investigated in respect to its influence on RF behaviour of packaged MEMS structures and transmission lines. The packaging solution explored is based on a wafer level packaging (WLP) approach where a capping high-resistivity silicon substrate containing vertical interconnect is adhesively bonded to an RF-MEMS wafer using ACA. After ACA bonding, conductive metal particles within the epoxy based matrix either contribute to the electrical path formation or, when uncompressed, remain isolated. Influence of such isolated particles on RF performance of adjacent structures has been studied using Ansoft HFSS electromagnetic simulator. The results show that the ACA layer might adversely affect performance of RF transmission lines by introducing additional losses. Keywords: ACA, WLP, RF MEMS, hybrid packaging.

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-85432-848-3

SP - 93

EP - 96

BT - 17th MicroMechanics Europe Workshop - Technical Digest

A2 - s.n., null

PB - University of Southampton

CY - Southampton

T2 - The 17th Micromechanics Europe Workshop, MME'06, Southampton, UK

Y2 - 3 September 2006 through 5 September 2006

ER -