RF-MEMS wafer-level packaging using through-wafer interconnect

J Tian, J Iannacci, R Gaddi, M Bartek

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageUndefined/Unknown
    Title of host publicationThe 20th European Conference on Solid-State Transducers (Eurosensors XX)
    Editors s.n.
    Place of PublicationGoeteborg
    PublisherChalmers University of Technology
    PagesT2CP7/1-T2CP7/4
    ISBN (Print)91-631-9281-0
    Publication statusPublished - 2006
    EventThe 20th European Conference on Solid-State Transducers (Eurosensors XX) - Goteborg, Sweden
    Duration: 17 Sep 200620 Sep 2006

    Publication series

    Name
    PublisherChalmers University of Technology

    Conference

    ConferenceThe 20th European Conference on Solid-State Transducers (Eurosensors XX)
    Period17/09/0620/09/06

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

    Cite this

    Tian, J., Iannacci, J., Gaddi, R., & Bartek, M. (2006). RF-MEMS wafer-level packaging using through-wafer interconnect. In s.n. (Ed.), The 20th European Conference on Solid-State Transducers (Eurosensors XX) (pp. T2CP7/1-T2CP7/4). Chalmers University of Technology.