RF-MEMS wafer-level packaging using through-wafer interconnect

J Tian; J Iannacci; R Gaddi; M Bartek

RF-MEMS wafer-level packaging using through-wafer interconnect

J Tian, J Iannacci, R Gaddi, M Bartek

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	The 20th European Conference on Solid-State Transducers (Eurosensors XX)
Editors	s.n.
Place of Publication	Goeteborg
Publisher	Chalmers University of Technology
Pages	T2CP7/1-T2CP7/4
ISBN (Print)	91-631-9281-0
Publication status	Published - 2006
Event	The 20th European Conference on Solid-State Transducers (Eurosensors XX) - Goteborg, Sweden Duration: 17 Sept 2006 → 20 Sept 2006

Publication series

Name
Publisher	Chalmers University of Technology

Conference

Conference	The 20th European Conference on Solid-State Transducers (Eurosensors XX)
Period	17/09/06 → 20/09/06

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{80188d9e81124833bc5c981d6a399307,

title = "RF-MEMS wafer-level packaging using through-wafer interconnect",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J Tian and J Iannacci and R Gaddi and M Bartek",

year = "2006",

language = "Undefined/Unknown",

isbn = "91-631-9281-0",

publisher = "Chalmers University of Technology",

pages = "T2CP7/1--T2CP7/4",

editor = "s.n.",

booktitle = "The 20th European Conference on Solid-State Transducers (Eurosensors XX)",

note = "The 20th European Conference on Solid-State Transducers (Eurosensors XX) ; Conference date: 17-09-2006 Through 20-09-2006",

}

RF-MEMS wafer-level packaging using through-wafer interconnect. / Tian, J; Iannacci, J; Gaddi, R et al.
The 20th European Conference on Solid-State Transducers (Eurosensors XX). ed. / s.n. Goeteborg: Chalmers University of Technology, 2006. p. T2CP7/1-T2CP7/4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - RF-MEMS wafer-level packaging using through-wafer interconnect

AU - Tian, J

AU - Iannacci, J

AU - Gaddi, R

AU - Bartek, M

PY - 2006

Y1 - 2006

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 91-631-9281-0

SP - T2CP7/1-T2CP7/4

BT - The 20th European Conference on Solid-State Transducers (Eurosensors XX)

A2 - s.n., null

PB - Chalmers University of Technology

CY - Goeteborg

T2 - The 20th European Conference on Solid-State Transducers (Eurosensors XX)

Y2 - 17 September 2006 through 20 September 2006

ER -