RF-MEMS wafer-level packaging using through-wafer via technology

J Tian, J Iannacci, S Sosin, R Gaddi, M Bartek

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    13 Citations (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationProc. 8th Electronics Packaging Technology Conference (EPTC 2006)
    EditorsJHL Pang
    Place of PublicationPiscataway
    PublisherIEEE Society
    Pages441-447
    Number of pages7
    ISBN (Print)1-4244-0664-1
    Publication statusPublished - 2006
    Event8th Electronics Packaging Technology Conference (EPTC 2006), Singapore - Piscataway
    Duration: 6 Dec 20068 Dec 2006

    Publication series

    Name
    PublisherIEEE
    Name
    Volume2

    Conference

    Conference8th Electronics Packaging Technology Conference (EPTC 2006), Singapore
    Period6/12/068/12/06

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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