@inproceedings{80d6d8cab1cd488c9e55785883971eff,
title = "Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide",
keywords = "Conf.proc. > 3 pag",
author = "V Rajaraman and LS Pakula and HTM Pham and PM Sarro and PJ French",
year = "2009",
language = "Undefined/Unknown",
isbn = "978-1-4244-2977-6",
publisher = "IEEE",
pages = "140--143",
editor = "PM Sarro and C Hierold",
booktitle = "Proc. IEEE MEMS 2009",
address = "United States",
note = "IEEE MEMS 2009 ; Conference date: 25-01-2009 Through 29-01-2009",
}