Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide

V Rajaraman; LS Pakula; HTM Pham; PM Sarro; PJ French

Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide

V Rajaraman, LS Pakula, HTM Pham, PM Sarro, PJ French

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

9 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proc. IEEE MEMS 2009
Editors	PM Sarro, C Hierold
Place of Publication	Sorrento, Italy
Publisher	IEEE Society
Pages	140-143
Number of pages	4
ISBN (Print)	978-1-4244-2977-6
Publication status	Published - 2009
Event	IEEE MEMS 2009 - Sorrento, Italy Duration: 25 Jan 2009 → 29 Jan 2009

Publication series

Name
Publisher	IEEE

Conference

Conference	IEEE MEMS 2009
Period	25/01/09 → 29/01/09

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{80d6d8cab1cd488c9e55785883971eff,

title = "Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide",

keywords = "Conf.proc. > 3 pag",

author = "V Rajaraman and LS Pakula and HTM Pham and PM Sarro and PJ French",

year = "2009",

language = "Undefined/Unknown",

isbn = "978-1-4244-2977-6",

publisher = "IEEE Society",

pages = "140--143",

editor = "PM Sarro and C Hierold",

booktitle = "Proc. IEEE MEMS 2009",

note = "IEEE MEMS 2009 ; Conference date: 25-01-2009 Through 29-01-2009",

}

Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide. / Rajaraman, V; Pakula, LS; Pham, HTM et al.
Proc. IEEE MEMS 2009. ed. / PM Sarro; C Hierold. Sorrento, Italy: IEEE Society, 2009. p. 140-143.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Robust wafer-level thin-film encapsulation of Microstructures using low stress PECVD silicon carbide

AU - Rajaraman, V

AU - Pakula, LS

AU - Pham, HTM

AU - Sarro, PM

AU - French, PJ

PY - 2009

Y1 - 2009

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 978-1-4244-2977-6

SP - 140

EP - 143

BT - Proc. IEEE MEMS 2009

A2 - Sarro, PM

A2 - Hierold, C

PB - IEEE Society

CY - Sorrento, Italy

T2 - IEEE MEMS 2009

Y2 - 25 January 2009 through 29 January 2009

ER -