ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

Model order reduction techniques are developed and utilized to make numerical simulations more efficient. The use of Reduce Order Models (ROM) also enables data exchange with external parties without disclosing the sensitive information present in a Full-Order Model (FOM). It is crucial to optimize for both the efficiency and accuracy of a ROM to keep a minimal deviation from the FOM. The complexity of a ROM-based simulation depends on the definition of the ROM as well as its connection with the remaining FOM. This paper investigates the effect of different ROM-FOM interface definitions for a test case consisting of an electronic package-on-PCB assembly. A virtual Design of Experiments (DoE) was carried out with a total of 41 cases considering three different locations and up to four different constraint equations for the ROM-FOM interface. The effect on the accuracy and time-efficiency of the ROM-based thermomechanical simulations are compared with respect to the full Finite Element (FE) model. The deformable configuration for the interface generally showed the most accurate results, while the rigid configuration was the most efficient across the board. The beam configuration did not always follow an expected trend based on the order of elasticity values of the assigned materials. Based on the deformation results and the time associated with ROM generation and use-pass, multiple optimal solutions from the DoE are discussed.