Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation

SW Koh; A Saxena; WD van Driel; GQ Zhang; R Tummala

doi:10.1007/978-1-4614-1728-6_5

Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation

SW Koh, A Saxena, WD van Driel, GQ Zhang, R Tummala

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

1 Citation (Scopus)

Original language	English
Title of host publication	Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Editors	N Iwamoto, MMF Yuen, H Fan
Place of Publication	New York
Publisher	Springer
Pages	77-90
Number of pages	260
ISBN (Print)	978-1-4614-1727-9
DOIs	https://doi.org/10.1007/978-1-4614-1728-6_5
Publication status	Published - 2012

Keywords

edited books
Boekdeel internat.wet

Access to Document

10.1007/978-1-4614-1728-6_5

Cite this

Koh, SW., Saxena, A., van Driel, WD., Zhang, GQ., & Tummala, R. (2012). Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation. In N. Iwamoto, MMF. Yuen, & H. Fan (Eds.), Molecular Modeling and Multiscaling Issues for Electronic Material Applications (pp. 77-90). Springer. https://doi.org/10.1007/978-1-4614-1728-6_5

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title = "Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation",

keywords = "edited books, Boekdeel internat.wet",

author = "SW Koh and A Saxena and {van Driel}, WD and GQ Zhang and R Tummala",

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Koh, SW, Saxena, A, van Driel, WD, Zhang, GQ & Tummala, R 2012, Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation. in N Iwamoto, MMF Yuen & H Fan (eds), Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Springer, New York, pp. 77-90. https://doi.org/10.1007/978-1-4614-1728-6_5

Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation. / Koh, SW; Saxena, A; van Driel, WD et al.
Molecular Modeling and Multiscaling Issues for Electronic Material Applications. ed. / N Iwamoto; MMF Yuen; H Fan. New York: Springer, 2012. p. 77-90.

Research output: Chapter in Book/Conference proceedings/Edited volume › Chapter › Scientific

TY - CHAP

T1 - Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation

AU - Koh, SW

AU - Saxena, A

AU - van Driel, WD

AU - Zhang, GQ

AU - Tummala, R

PY - 2012

Y1 - 2012

KW - edited books

KW - Boekdeel internat.wet

U2 - 10.1007/978-1-4614-1728-6_5

DO - 10.1007/978-1-4614-1728-6_5

M3 - Chapter

SN - 978-1-4614-1727-9

SP - 77

EP - 90

BT - Molecular Modeling and Multiscaling Issues for Electronic Material Applications

A2 - Iwamoto, N

A2 - Yuen, MMF

A2 - Fan, H

PB - Springer

CY - New York

ER -

Koh SW, Saxena A, van Driel WD, Zhang GQ, Tummala R. Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation. In Iwamoto N, Yuen MMF, Fan H, editors, Molecular Modeling and Multiscaling Issues for Electronic Material Applications. New York: Springer. 2012. p. 77-90 doi: 10.1007/978-1-4614-1728-6_5