Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation

SW Koh, A Saxena, WD van Driel, GQ Zhang, R Tummala

Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

1 Citation (Scopus)
Original languageEnglish
Title of host publicationMolecular Modeling and Multiscaling Issues for Electronic Material Applications
EditorsN Iwamoto, MMF Yuen, H Fan
Place of PublicationNew York
PublisherSpringer
Pages77-90
Number of pages260
ISBN (Print)978-1-4614-1727-9
DOIs
Publication statusPublished - 2012

Keywords

  • edited books
  • Boekdeel internat.wet

Cite this

Koh, SW., Saxena, A., van Driel, WD., Zhang, GQ., & Tummala, R. (2012). Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation. In N. Iwamoto, MMF. Yuen, & H. Fan (Eds.), Molecular Modeling and Multiscaling Issues for Electronic Material Applications (pp. 77-90). Springer. https://doi.org/10.1007/978-1-4614-1728-6_5