Sensitivity computation of interconnect capacitances with respect to geometric parameters

Y Bi; KJ van der Kolk; D. Ioan; NP van der Meijs

Sensitivity computation of interconnect capacitances with respect to geometric parameters

Y Bi, KJ van der Kolk, D. Ioan, NP van der Meijs

Signal Processing Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

6 Citations (Scopus)

Original language	Undefined/Unknown
Title of host publication	The 17th IEEE Conference on Electrical Performance of Electronic Packaging, EPEP 2008
Editors	M Lamson, A Weisshaar
Place of Publication	San Jose, U.S.A.
Publisher	IEEE Society
Pages	1-4
Number of pages	4
Publication status	Published - 2008
Event	EPEP 2008, San Jose, U.S.A. - San Jose, U.S.A. Duration: 27 Oct 2008 → 29 Oct 2008

Publication series

Name
Publisher	IEEE

Conference

Conference	EPEP 2008, San Jose, U.S.A.
Period	27/10/08 → 29/10/08

Keywords

Elektrotechniek
Techniek
conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{a7deee7f5a894be6ad368e8444166cb9,

title = "Sensitivity computation of interconnect capacitances with respect to geometric parameters",

keywords = "Elektrotechniek, Techniek, conference contrib. refereed, Conf.proc. > 3 pag",

author = "Y Bi and {van der Kolk}, KJ and D. Ioan and {van der Meijs}, NP",

year = "2008",

language = "Undefined/Unknown",

publisher = "IEEE Society",

pages = "1--4",

editor = "M Lamson and A Weisshaar",

booktitle = "The 17th IEEE Conference on Electrical Performance of Electronic Packaging, EPEP 2008",

note = "null ; Conference date: 27-10-2008 Through 29-10-2008",

}

Sensitivity computation of interconnect capacitances with respect to geometric parameters. / Bi, Y; van der Kolk, KJ; Ioan, D.; van der Meijs, NP.

The 17th IEEE Conference on Electrical Performance of Electronic Packaging, EPEP 2008. ed. / M Lamson; A Weisshaar. San Jose, U.S.A. : IEEE Society, 2008. p. 1-4.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Sensitivity computation of interconnect capacitances with respect to geometric parameters

AU - Bi, Y

AU - van der Kolk, KJ

AU - Ioan, D.

AU - van der Meijs, NP

PY - 2008

Y1 - 2008

KW - Elektrotechniek

KW - Techniek

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SP - 1

EP - 4

BT - The 17th IEEE Conference on Electrical Performance of Electronic Packaging, EPEP 2008

A2 - Lamson, M

A2 - Weisshaar, A

PB - IEEE Society

CY - San Jose, U.S.A.

Y2 - 27 October 2008 through 29 October 2008

ER -