Shape fitting: Application to the estimation of wafer chuck deformation

Johan Vogel

Research output: ThesisDissertation (TU Delft)

40 Downloads (Pure)

Abstract

In wafer scanners - the machines that define the details of electronic chips - there is a need for highly accurate deformation measurements of the machine components during the chip manufacturing process.
This thesis develops an estimation methodology, based on shape fitting principles, that aims at a low estimation error and addresses the specific requirements related to one of the components of a wafer scanner, the wafer chuck.
Original languageEnglish
QualificationDoctor of Philosophy
Awarding Institution
  • Delft University of Technology
Supervisors/Advisors
  • Munnig Schmidt, Robert, Supervisor
  • Spronck, J.W., Advisor
Thesis sponsors
Award date10 Oct 2016
Print ISBNs978-94-028-0338-9
DOIs
Publication statusPublished - 2016

Keywords

  • shape estimation
  • shape fitting
  • wafer chuck deformation
  • least squares optimisation
  • position sensing

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