Shellcase-type wafer-level packaging solutions: RF characterization and modeling

M Bartek, G Zilber, D Teomin, SM Sinaga, A Polyakov, JN Burghartz

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageUndefined/Unknown
    Title of host publication2004 International Wafer-Level Packaging Congress (IWLPC)
    Place of PublicationEdina, USA
    PublisherSMTA
    Pages1-6
    Number of pages6
    Publication statusPublished - 2004
    EventFirst International Wafer-Level Packaging Congress, San Jose, USA - Edina, USA
    Duration: 10 Oct 200412 Oct 2004

    Publication series

    Name
    PublisherSMTA

    Conference

    ConferenceFirst International Wafer-Level Packaging Congress, San Jose, USA
    Period10/10/0412/10/04

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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