Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process

Zahra Koladouz Esfahani, Teng Ma, Mohammadreza Kolahdouz, Henk van Zeijl, Guoqi Zhang

Research output: Contribution to journalArticleScientificpeer-review

Abstract

Today, finding a low cost, efficient, functional and reliable solution for controlling smart lighting systems has become topic of many research groups and industry. In this study, a multi-functional wafer level package (WLP) for phosphor-based white LED system has been designed and manufactured using 7-mask BiCMOS process. This package integrates 4 high power blue LED dies with a temperature sensor and a blue selective light sensor for monitoring system performance. Each sensor has been designed, characterized and calibrated to be part of the smart monitoring unit. An interdigitated power transistor and a 4-bit flash analog-to-digital converter (ADC) were also monolithically integrated with sensors’ readout and extra controlling functions.

Original languageEnglish
Pages (from-to)622-632
Number of pages11
JournalSensors and Actuators, A: Physical
Volume263
DOIs
Publication statusPublished - 2017

Keywords

  • BiCMOS process
  • Flash ADC
  • Light sensor
  • Light-emitting diodes
  • Optoelectronics
  • Photodetectors
  • Sensor readout system
  • Temperature sensor
  • Wafer level package

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