Silicon micromachining of high-aspect ratio, high-density through-wafer electrical interconnects for 3D multichip packaging

L Wang, PM Sarro, JN Burghartz, Z. Wang

Research output: Contribution to journalArticleScientificpeer-review

38 Citations (Scopus)
Original languageUndefined/Unknown
Pages (from-to)615-622
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume29
Issue number3
Publication statusPublished - 2006

Keywords

  • academic journal papers
  • CWTS 0.75 <= JFIS < 2.00

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