@article{fbdddb92697c4d4fac14a54b2e23f64d,
title = "Silicon micromachining of high-aspect ratio, high-density through-wafer electrical interconnects for 3D multichip packaging",
keywords = "academic journal papers, CWTS 0.75 <= JFIS < 2.00",
author = "L Wang and PM Sarro and JN Burghartz and Z. Wang",
year = "2006",
language = "Undefined/Unknown",
volume = "29",
pages = "615--622",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "1521-3323",
publisher = "Institute of Electrical and Electronics Engineers (IEEE)",
number = "3",
}