TY - GEN
T1 - Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications
AU - Wang, Xinyue
AU - Yang, Zhoudong
AU - Zhang, Guoqi
AU - Zhang, Jing
AU - Liu, Pan
N1 - Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
PY - 2023
Y1 - 2023
N2 - With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost and anti-electro migration ability. However, the potential difference between copper and silver forms galvanic corrosion in a high-humidity environment, resulting in accelerated failure combined with salt mist. To further promote the application of composite sintered materials, a copper-silver double-sphere galvanic corrosion model based on finite element simulation was proposed in this paper. The relationship between corrosion rate and time of different Cu-Ag particle size combinations under different sintering degrees was predicted by initial exchange current density. Through the electrochemical characterization of the sintered samples, the optimal combination of materials was further discussed. The accuracy of the model was also verified. The conclusions obtained from both the experiments and simulation work provide guidance for future anti-corrosion analysis, as well as the reliability improvement of novel composite sintered materials.
AB - With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost and anti-electro migration ability. However, the potential difference between copper and silver forms galvanic corrosion in a high-humidity environment, resulting in accelerated failure combined with salt mist. To further promote the application of composite sintered materials, a copper-silver double-sphere galvanic corrosion model based on finite element simulation was proposed in this paper. The relationship between corrosion rate and time of different Cu-Ag particle size combinations under different sintering degrees was predicted by initial exchange current density. Through the electrochemical characterization of the sintered samples, the optimal combination of materials was further discussed. The accuracy of the model was also verified. The conclusions obtained from both the experiments and simulation work provide guidance for future anti-corrosion analysis, as well as the reliability improvement of novel composite sintered materials.
KW - die-attach material
KW - FEM simulation
KW - galvanic corrosion
KW - power electronic packaging
UR - http://www.scopus.com/inward/record.url?scp=85168312061&partnerID=8YFLogxK
U2 - 10.1109/ECTC51909.2023.00341
DO - 10.1109/ECTC51909.2023.00341
M3 - Conference contribution
AN - SCOPUS:85168312061
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1982
EP - 1988
BT - Proceedings - IEEE 73rd Electronic Components and Technology Conference, ECTC 2023
PB - IEEE
T2 - 73rd IEEE Electronic Components and Technology Conference, ECTC 2023
Y2 - 30 May 2023 through 2 June 2023
ER -