Simulation, Prediction, and Verification of the Corrosion Behavior of Cu-Ag Composite Sintered Paste for Power Semiconductor Die-attach Applications

With the popularization of wide band-gap power modules in offshore wind power systems and water surface photovoltaic power stations, packaging materials face challenges of corrosion by salt, blended with high humidity. Copper-silver (Cu-Ag) composite sintered paste was proposed by researchers as a novel die-attach material for a lower cost and anti-electro migration ability. However, the potential difference between copper and silver forms galvanic corrosion in a high-humidity environment, resulting in accelerated failure combined with salt mist. To further promote the application of composite sintered materials, a copper-silver double-sphere galvanic corrosion model based on finite element simulation was proposed in this paper. The relationship between corrosion rate and time of different Cu-Ag particle size combinations under different sintering degrees was predicted by initial exchange current density. Through the electrochemical characterization of the sintered samples, the optimal combination of materials was further discussed. The accuracy of the model was also verified. The conclusions obtained from both the experiments and simulation work provide guidance for future anti-corrosion analysis, as well as the reliability improvement of novel composite sintered materials.