Simulation, Prediction and Verification of the Thermal and Electrical Properties of Sintered Copper Joints with Random Pore Structure for Power Electronics Packaging

Wenting Liu, Jianhao Wang, Yue Gao, Liangzheng Ji, Jing Zhang, Guoqi Zhang, Pan Liu*

*Corresponding author for this work

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Copper sintering has gained great attention as a die-attach technology for power electronics because of its potential cost effectiveness and high reliability under harsh working conditions. However, the mechanism of how the intrinsic pores within such sintered joints influence the thermal and electrical properties still needs further investigation. The evolution of pores within such sintered joints is difficult for in-situ observation during the sintering process and reliability tests, while the porosity level greatly affects the thermal and electrical properties. In this work, four two-dimensional (2D) models with various random pore structures were established based on the Quartet Structure Generation Set (QSGS) algorithm. Then, finite element method (FEM) simulations were conducted to simulate the heat and current conduction in the sintered materials. Subsequently, the distribution of temperature as well as the electric potential in the porous sintered materials were further discussed. Lastly, both the thermal and the electrical conductivities were calculated, followed by a concluded parabolic relationship of thermal and electrical conductivities with the porosity. These findings offer insights into optimizing and predicting copper sintered joint performance and accelerate the wide application of copper sintering.

Original languageEnglish
Title of host publicationProceedings of the 2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
PublisherIEEE
Number of pages6
ISBN (Electronic)979-8-3503-5380-8
ISBN (Print)979-8-3503-5381-5
DOIs
Publication statusPublished - 2024
Event25th International Conference on Electronic Packaging Technology, ICEPT 2024 - Tianjin, China
Duration: 7 Aug 20249 Aug 2024

Conference

Conference25th International Conference on Electronic Packaging Technology, ICEPT 2024
Country/TerritoryChina
CityTianjin
Period7/08/249/08/24

Bibliographical note

Green Open Access added to TU Delft Institutional Repository 'You share, we take care!' - Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • copper sintering
  • porosity
  • thermal and electrical performance

Fingerprint

Dive into the research topics of 'Simulation, Prediction and Verification of the Thermal and Electrical Properties of Sintered Copper Joints with Random Pore Structure for Power Electronics Packaging'. Together they form a unique fingerprint.

Cite this