Simulation, Prediction and Verification of the Thermal and Electrical Properties of Sintered Copper Joints with Random Pore Structure for Power Electronics Packaging
- Wenting Liu
- , Jianhao Wang
- , Yue Gao
- , Liangzheng Ji
- , Jing Zhang
- , Guoqi Zhang
- , Pan Liu*
*Corresponding author for this work
Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review
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