INIS
simulation
100%
devices
100%
packaging
100%
mechanical properties
100%
gallium nitrides
100%
design
44%
dies
33%
thermal stresses
22%
power density
22%
sintering
22%
copper
22%
semiconductor materials
22%
silver
11%
surfaces
11%
power
11%
finite element method
11%
cooling
11%
applications
11%
metals
11%
layers
11%
volume
11%
thermal conductivity
11%
silicon carbides
11%
Material Science
Devices
100%
Thermal Stress
66%
Density
66%
Copper
66%
Sintering
66%
Semiconductor Material
33%
Finite Element Method
33%
Electronics
33%
Thermal Conductivity
33%
Temperature
33%
Silver
33%
Packaging Material
33%
Metal
33%
Surface
33%
Engineering
Mechanical Properties
100%
Design
100%
Power Density
50%
Energy Gap
25%
Application Field
25%
Finite Element Method
25%
Comparative Study
25%
Gap Semiconductor
25%
Thermal Dissipation
25%
Semiconductor
25%