Abstract
This paper presents a new method for the CMOS compatible fabrication of microchannels integrated into a silicon substrate. In a single-step DRIE process (Deep Reactive Ion Etching) a network of microchannels with High Aspect Ratio (HAR) up to 10, can be etched in a silicon substrate through a mesh mask. In the same single etching step, multidimensional microchannels with various dimensions (width, length, and depth) can be obtained by tuning the process and design parameters. These fully embedded structures enable further wafer processing and integration of electronic components like sensors and actuators in wafers with microchannels.
Original language | English |
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Title of host publication | Proceedings of Eurosensors 2017 |
Pages | 1-4 |
Number of pages | 4 |
DOIs | |
Publication status | Published - 2017 |
Event | Eurosensors 2017: 31st Conference - Paris, France Duration: 3 Sept 2017 → 6 Sept 2017 Conference number: 31 http://www.eurosensors2017.eu/ |
Publication series
Name | Proceedings |
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Publisher | MDPI |
Number | 4 |
Volume | 1 |
ISSN (Print) | 2504-3900 |
Conference
Conference | Eurosensors 2017 |
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Country/Territory | France |
City | Paris |
Period | 3/09/17 → 6/09/17 |
Internet address |
Keywords
- embedded microchannel
- HAR
- mesh mask
- single-step DRIE (Bosch process)