Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

JJM Zaal, HP Hochstenbach, WD van Driel, GQ Zhang

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)

Abstract

The use of microelectronic components in mobile appliances is constantly increasing. Appliances like mobile phones, PDA's and navigation systems contain more and more functionality and smaller microelectronic components.
Original languageUndefined/Unknown
Pages (from-to)846-852
Number of pages7
JournalMicroelectronics Reliability
Volume49
Issue number2009
Publication statusPublished - 2009

Keywords

  • academic journal papers
  • CWTS JFIS < 0.75

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