Solders fatigue prediction using interfacial boundary volume criterion

XJ Zhao; GQ Zhang; JFJM Caers; LJ Ernst

Solders fatigue prediction using interfacial boundary volume criterion

XJ Zhao, GQ Zhang, JFJM Caers, LJ Ernst

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics
Editors	LJ Ernst, GQ Zhang, R Dudek, O de Saint Leger
Place of Publication	Piscataway
Publisher	Institute of Electrical and Electronic Engineers (IEEE)
Pages	140-147
Number of pages	8
ISBN (Print)	0-7803-9819-X
Publication status	Published - 2002
Event	EuroSimE 2002 - Paris, France Duration: 15 Apr 2002 → 17 Apr 2002

Publication series

Name
Publisher	The Institute of Electrical and Electronics Engineers

Conference

Conference	EuroSimE 2002
Country/Territory	France
City	Paris
Period	15/04/02 → 17/04/02

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{06c6eb57b69a4212b329fa571628708f,

title = "Solders fatigue prediction using interfacial boundary volume criterion",

keywords = "Conf.proc. > 3 pag",

author = "XJ Zhao and GQ Zhang and JFJM Caers and LJ Ernst",

year = "2002",

language = "Undefined/Unknown",

isbn = "0-7803-9819-X",

publisher = "Institute of Electrical and Electronic Engineers (IEEE)",

pages = "140--147",

editor = "LJ Ernst and GQ Zhang and R Dudek and {de Saint Leger}, O",

booktitle = "3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics",

note = "EuroSimE 2002 ; Conference date: 15-04-2002 Through 17-04-2002",

}

Zhao, XJ, Zhang, GQ, Caers, JFJM & Ernst, LJ 2002, Solders fatigue prediction using interfacial boundary volume criterion. in LJ Ernst, GQ Zhang, R Dudek & O de Saint Leger (eds), 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. Institute of Electrical and Electronic Engineers (IEEE), Piscataway, pp. 140-147, EuroSimE 2002, Paris, France, 15/04/02.

Solders fatigue prediction using interfacial boundary volume criterion. / Zhao, XJ; Zhang, GQ; Caers, JFJM et al.
3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics. ed. / LJ Ernst; GQ Zhang; R Dudek; O de Saint Leger. Piscataway: Institute of Electrical and Electronic Engineers (IEEE), 2002. p. 140-147.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Solders fatigue prediction using interfacial boundary volume criterion

AU - Zhao, XJ

AU - Zhang, GQ

AU - Caers, JFJM

AU - Ernst, LJ

PY - 2002

Y1 - 2002

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 0-7803-9819-X

SP - 140

EP - 147

BT - 3rd international conference on benefiting from thermal and mechanical simulation in (micro)electronics

A2 - Ernst, LJ

A2 - Zhang, GQ

A2 - Dudek, R

A2 - de Saint Leger, O

PB - Institute of Electrical and Electronic Engineers (IEEE)

CY - Piscataway

T2 - EuroSimE 2002

Y2 - 15 April 2002 through 17 April 2002

ER -