Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]

Willem D. van Driel; Artur  Wymyslowski

doi:10.1016/j.microrel.2018.06.012

Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]

Willem D. van Driel^*, Artur Wymyslowski

^*Corresponding author for this work

Electronic Components, Technology and Materials

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Original language	English
Pages (from-to)	321-321
Number of pages	1
Journal	Microelectronics Reliability
Volume	87
DOIs	https://doi.org/10.1016/j.microrel.2018.06.012
Publication status	Published - 2018
Event	18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017: 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Dresden, Germany Duration: 3 Apr 2017 → 5 Apr 2017

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Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

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title = "Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]",

author = "{van Driel}, {Willem D.} and Artur Wymyslowski",

note = "Green Open Access added to TU Delft Institutional Repository {\textquoteleft}You share, we take care!{\textquoteright} – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public. ; 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017 : 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems ; Conference date: 03-04-2017 Through 05-04-2017",

year = "2018",

doi = "10.1016/j.microrel.2018.06.012",

language = "English",

volume = "87",

pages = "321--321",

journal = "Microelectronics Reliability",

issn = "0026-2714",

publisher = "Elsevier",

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T1 - Special issue

T2 - 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017

AU - van Driel, Willem D.

AU - Wymyslowski, Artur

N1 - Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

PY - 2018

Y1 - 2018

UR - http://www.scopus.com/inward/record.url?scp=85049322111&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2018.06.012

DO - 10.1016/j.microrel.2018.06.012

M3 - Editorial

AN - SCOPUS:85049322111

SN - 0026-2714

VL - 87

SP - 321

EP - 321

JO - Microelectronics Reliability

JF - Microelectronics Reliability

Y2 - 3 April 2017 through 5 April 2017

ER -

Special issue: International conference on thermal, mechanical & multiphysics simulation and experiments in micro- and nano-electronics and systems [EuroSimE2017]

Bibliographical note

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