State dependent constitutive modeling of curing molding compounds

LJ Ernst; KMB Jansen; D Yang; C van t Hof; HJL Bressers; GQ Zhang

State dependent constitutive modeling of curing molding compounds

LJ Ernst, KMB Jansen, D Yang, C van t Hof, HJL Bressers, GQ Zhang

Dynamics of Micro and Nano Systems

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	EMAP 2004: 6th international conference on electronic materials and packaging
Editors	ZM Ripin, KN Seetharamu, MZ Abdullah, Z Samad, S Shuib
Place of Publication	S.l.
Publisher	IEEE CPMT
Pages	23-29
Number of pages	7
ISBN (Print)	983-2514-86-X
Publication status	Published - 2004
Event	Conference, Penang - S.l. Duration: 5 Dec 2004 → 7 Dec 2004

Publication series

Name
Publisher	IEEE CPMT

Conference

Conference	Conference, Penang
Period	5/12/04 → 7/12/04

Keywords

Conf.proc. > 3 pag

Cite this

@inproceedings{689ee8bc30d84ee59887d21b62f0d019,

title = "State dependent constitutive modeling of curing molding compounds",

keywords = "Conf.proc. > 3 pag",

author = "LJ Ernst and KMB Jansen and D Yang and {van t Hof}, C and HJL Bressers and GQ Zhang",

year = "2004",

language = "Undefined/Unknown",

isbn = "983-2514-86-X",

publisher = "IEEE CPMT",

pages = "23--29",

editor = "ZM Ripin and KN Seetharamu and MZ Abdullah and Z Samad and S Shuib",

booktitle = "EMAP 2004: 6th international conference on electronic materials and packaging",

note = "Conference, Penang ; Conference date: 05-12-2004 Through 07-12-2004",

}

State dependent constitutive modeling of curing molding compounds. / Ernst, LJ; Jansen, KMB; Yang, D et al.
EMAP 2004: 6th international conference on electronic materials and packaging. ed. / ZM Ripin; KN Seetharamu; MZ Abdullah; Z Samad; S Shuib. S.l.: IEEE CPMT, 2004. p. 23-29.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - State dependent constitutive modeling of curing molding compounds

AU - Ernst, LJ

AU - Jansen, KMB

AU - Yang, D

AU - van t Hof, C

AU - Bressers, HJL

AU - Zhang, GQ

PY - 2004

Y1 - 2004

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 983-2514-86-X

SP - 23

EP - 29

BT - EMAP 2004: 6th international conference on electronic materials and packaging

A2 - Ripin, ZM

A2 - Seetharamu, KN

A2 - Abdullah, MZ

A2 - Samad, Z

A2 - Shuib, S

PB - IEEE CPMT

CY - S.l.

T2 - Conference, Penang

Y2 - 5 December 2004 through 7 December 2004

ER -