Strong doping reduction on wafer-scale CVD graphene devices via Al2O3 ALD encapsulation

K. Dockx*, M. D. Barnes, D. J. Wehenkel, R. van Rijn, H. S.J. van der Zant*, M. Buscema*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

Abstract

We present the electrical characterization of wafer-scale graphene devices fabricated with an industrially-relevant, contact-first integration scheme combined with Al2O3 encapsulation via atomic layer deposition. All the devices show a statistically significant reduction in the Dirac point position, V cnp , from around +47 V to between −5 and 5 V (on 285 nm SiO2), while maintaining the mobility values. The data and methods presented are relevant for further integration of graphene devices, specifically sensors, at the back-end-of-line of a standard CMOS flow.

Original languageEnglish
Article number395202
JournalNanotechnology
Volume35
Issue number39
DOIs
Publication statusPublished - 2024

Bibliographical note

Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care
Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.

Keywords

  • atomic layer deposition
  • electronics
  • graphene

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