Study and Application of Nano Copper Sintering Technology in Power Electronics Packaging

X. Liu, Quan Zhou, Xu Zhao, Sau Wee Koh, Huaiyu Ye, Guoqi Zhang

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

Abstract

Nano-metal sintering has been proven to be a promising die attachment technology for power electronics packaging in the high-end application. Compared with nano silver technology, it is believed that copper-based sintering technology has better cost and performance superiority, and thus has more potential to be utilized in the industry in the future. However, most of the current developed nano copper sintering material and technology shows bad performance with high sintering energy input. In this study, a novel nano-copper based paste has been developed with excellent process ability (sinterable below 280°C for 10 min with low pressure assisted) and good material property (over 40 MPa shear strength), which turns out to be suitable for the state-of-the-art packaging process. Then the material was applied into a SiC power module packaging scenario which shows comparable performance as silver sintering. The whole process only consumed less than 0.5h for each batch, which indicates that the copper sintering technology has great potential for the packaging application in high power situation.
Original languageEnglish
Title of host publication2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
EditorsL. O'Conner
Place of PublicationPiscataway
PublisherIEEE
Pages1928-1932
Number of pages5
ISBN (Electronic)978-1-6654-4097-4
ISBN (Print)978-1-6654-3120-0
DOIs
Publication statusPublished - 2021
Event2021 IEEE 71st Electronic Components and Technology Conference (ECTC) - Virtual at San Diego, United States
Duration: 1 Jun 20214 Jul 2021
Conference number: 71st

Publication series

NameIEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)
ISSN (Print)0569-5503

Conference

Conference2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
Country/TerritoryUnited States
CityVirtual at San Diego
Period1/06/214/07/21

Keywords

  • power electronics packaging
  • nano Cu sintering
  • shear strength
  • thermal behavior
  • reliability performance

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