@inproceedings{0f8136e552b544b3abf9e355b7e17c82,
title = "Study of the Effects of Molding Pressure on the Warpage of HVQFN Packages",
keywords = "conference contrib. refereed, Conf.proc. > 3 pag",
author = "DY Gui and LJ Ernst and KMB Jansen and D Yang and L Goumans and HJL Bressers and JHJ Janssen",
year = "2005",
language = "Undefined/Unknown",
isbn = "0-7803-9449-6",
publisher = "IEEE Society",
pages = "338--343",
editor = "Keyun and Bi and Chunqing and Wang",
booktitle = "Proceedings of 2005 6th International Conference on Electronic Packaging Technology",
note = "2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China ; Conference date: 30-08-2005 Through 02-09-2005",
}