Study of the Effects of Molding Pressure on the Warpage of HVQFN Packages

DY Gui, LJ Ernst, KMB Jansen, D Yang, L Goumans, HJL Bressers, JHJ Janssen

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageUndefined/Unknown
Title of host publicationProceedings of 2005 6th International Conference on Electronic Packaging Technology
Editors Keyun, Bi, Chunqing, Wang
Place of PublicationPiscataway, New Jersey
PublisherIEEE Society
Pages338-343
Number of pages6
ISBN (Print)0-7803-9449-6
Publication statusPublished - 2005
Event2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China - Piscataway, New Jersey
Duration: 30 Aug 20052 Sep 2005

Publication series

Name
PublisherIEEE

Conference

Conference2005 6th International Conference on Electronic Packaging Technology, Shenzhen, China
Period30/08/052/09/05

Keywords

  • conference contrib. refereed
  • Conf.proc. > 3 pag

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