Study of the Post-Buckling Behavior of Circular Plates under Thermal Load Using a Reduced-Order Model

WF Faris, MM Abdalla

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    Original languageUndefined/Unknown
    Title of host publicationProceedings of the Sixth International Congress on Thermal Stresses
    EditorsF Ziegler, R Heuer
    Place of PublicationVienna
    PublisherVienna University of Technoclogy
    Pages607-610
    Number of pages4
    ISBN (Print)3-901167-12
    Publication statusPublished - 2005
    EventSixth International Congress on Thermal Stresses, Vienna, Austria - Vienna
    Duration: 26 May 200529 May 2005

    Publication series

    Name
    PublisherVienna University of Technology

    Conference

    ConferenceSixth International Congress on Thermal Stresses, Vienna, Austria
    Period26/05/0529/05/05

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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