Study of thermal aging behavior of epoxy molding compound for applications in harsh environments

Adwait Inamdar, Alexandru Prisacaru, Martin Fleischman, Erick Franieck, Przemyslaw Gromala, Agnes Veres, Csaba Nemeth, Yu Hsiang Yang, Bongtae Han

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

4 Citations (Scopus)


In the automotive industry, epoxy-based molding compounds (EMCs) are often used to protect not only single IC packages but also entire electronic control units (ECUs). The EMC undergoes thermal aging during the operation-lifecycle of its parent electronic package. The thermal aging oxidizes the EMC, which can alter its mechanical properties significantly. Understanding the oxidation phenomenon of EMC and its effect on property changes is critically required to predict the reliability of ECUs subjected to harsh environments. In this study, the oxidation phenomenon of EMC is characterized experimentally by measuring oxidation growth rate and the mechanical properties of oxidized EMC. In the first task, EMC samples are subjected to three different high temperature storage (HTS) conditions - 170 °C, 200 °C and 230 °C. The thicknesses of the oxidized layers are measured as a function of storage time (from 0 to 1500 hours) using a fluorescent microscope. The oxidation growth rates at the storage temperatures are determined from the thickness measurements, and they are subsequently used to determine the activation energy of the growth rate. In the second task, thin samples (300 μm thick) are subjected to a HTS condition until they are fully oxidized. Then, critical thermo-mechanical properties of oxidized EMC, including coefficient of thermal expansion (CTE), glass transition temperature, and modulus of elasticity, are measured using digital image correlation (DIC) and dynamic mechanical analysis (DMA), respectively. The detailed procedures of the experimental characterization are presented together with the test results. Their implications on the ECU reliability is also discussed.

Original languageEnglish
Title of host publicationProceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PublisherInstitute of Electrical and Electronics Engineers (IEEE)
Number of pages8
ISBN (Electronic)9781728114989
Publication statusPublished - May 2019
Externally publishedYes
Event69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
Duration: 28 May 201931 May 2019

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503


Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
Country/TerritoryUnited States
CityLas Vegas


  • Activation energy
  • Coefficient of thermal expansion (CTE)
  • Digital image correlation (DIC)
  • Dynamic mechanical analysis (DMA)
  • Epoxy molding compound (EMC)
  • Fluorescence microscopy
  • Glass transition temperature
  • Material characterization
  • Moiré interferometry
  • Oxidation
  • Thermal aging


Dive into the research topics of 'Study of thermal aging behavior of epoxy molding compound for applications in harsh environments'. Together they form a unique fingerprint.

Cite this