Study of thermal and thermo-mechanical behavior in a multi-chip-composed optoelectronic package

J Tian, M Bartek

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	Undefined/Unknown
Title of host publication	Proc. 9th Electronics Packaging Technology Conference (EPTC 2007)
Editors	s.n.
Place of Publication	Piscataway
Publisher	IEEE Society
Pages	886-891
Number of pages	6
ISBN (Print)	1-4244-1323-0
Publication status	Published - 2007
Event	9th Electronics Packaging Technology Conference (EPTC 2007) - Piscataway Duration: 10 Dec 2007 → 12 Dec 2007

Name
Publisher	IEEE

Conference	9th Electronics Packaging Technology Conference (EPTC 2007)
Period	10/12/07 → 12/12/07

Keywords

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title = "Study of thermal and thermo-mechanical behavior in a multi-chip-composed optoelectronic package",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "J Tian and M Bartek",

year = "2007",

language = "Undefined/Unknown",

isbn = "1-4244-1323-0",

publisher = "IEEE Society",

pages = "886--891",

editor = "s.n.",

booktitle = "Proc. 9th Electronics Packaging Technology Conference (EPTC 2007)",

note = "9th Electronics Packaging Technology Conference (EPTC 2007) ; Conference date: 10-12-2007 Through 12-12-2007",

}

TY - GEN

T1 - Study of thermal and thermo-mechanical behavior in a multi-chip-composed optoelectronic package

AU - Tian, J

AU - Bartek, M

PY - 2007

Y1 - 2007

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 1-4244-1323-0

SP - 886

EP - 891

BT - Proc. 9th Electronics Packaging Technology Conference (EPTC 2007)

A2 - s.n., null

PB - IEEE Society

CY - Piscataway

T2 - 9th Electronics Packaging Technology Conference (EPTC 2007)

Y2 - 10 December 2007 through 12 December 2007

ER -