Study of thermal and thermo-mechanical behavior in a multi-chip-composed optoelectronic package

J Tian, M Bartek

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

    1 Citation (Scopus)
    Original languageUndefined/Unknown
    Title of host publicationProc. 9th Electronics Packaging Technology Conference (EPTC 2007)
    Editors s.n.
    Place of PublicationPiscataway
    PublisherIEEE
    Pages886-891
    Number of pages6
    ISBN (Print)1-4244-1323-0
    Publication statusPublished - 2007
    Event9th Electronics Packaging Technology Conference (EPTC 2007) - Piscataway
    Duration: 10 Dec 200712 Dec 2007

    Publication series

    Name
    PublisherIEEE

    Conference

    Conference9th Electronics Packaging Technology Conference (EPTC 2007)
    Period10/12/0712/12/07

    Keywords

    • conference contrib. refereed
    • Conf.proc. > 3 pag

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