Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties

X. Liu; Quan Zhou; Qipeng Liu; Honghao  Tang; Chenshan Gao; Bin Xie; Sau Wee Koh; Huaiyu Ye; Guoqi Zhang

doi:10.1109/ICEPT50128.2020.9201937

Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties

X. Liu, Quan Zhou, Qipeng Liu, Honghao Tang, Chenshan Gao, Bin Xie, Sau Wee Koh, Huaiyu Ye, Guoqi Zhang

Electronic Components, Technology and Materials

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Abstract

Nano-metal sintering is a promising technology for the next generation of semiconductor packaging due to its positive effect on reliability enhancement. Compared with the silver sintering, copper-based sintering technique has more potential to be applied in die attachment field as its superiorities on lower cost, higher melting temperature without electromigration. In this study, Taguchi method is applied to study and analyze the effect of nano-/micro- particle ratio on sintering properties. Sintering temperature is also taken into account since it depends on the particle size a lot. The results show that both sintering temperature and nano-micro- ratio play significant role on influencing shear strength. The best combination is 300 nm with 1 um mixing (1:1) with over 35 MPa shear strength with 300°C sintering temperature. The fracture surface result shows that the crack propagated in the sintering body. Furthermore, the cross-section inspection reveals dense bonding and clearly sintering necking, and the porosity is lower than 12%. 227.8 W/m*K thermal conductivity and 6.0 uΩ·cm electrical resistivity are measured for the sample, which indicates the great potential for the packaging application in high power situation.

Original language	English
Title of host publication	2020 21st International Conference on Electronic Packaging Technology (ICEPT)
Subtitle of host publication	Proceedings
Publisher	IEEE
Pages	1-5
Number of pages	5
ISBN (Electronic)	978-1-7281-6826-5
ISBN (Print)	978-1-7281-6827-2
DOIs	https://doi.org/10.1109/ICEPT50128.2020.9201937
Publication status	Published - 2020
Event	21st International Conference on Electronic Packaging Technology, ICEPT 2020 - Guangzhou, China Duration: 12 Aug 2020 → 15 Aug 2020

Conference

Conference	21st International Conference on Electronic Packaging Technology, ICEPT 2020
Country/Territory	China
City	Guangzhou
Period	12/08/20 → 15/08/20

Keywords

Nano copper
sintering technology

Access to Document

10.1109/ICEPT50128.2020.9201937

Cite this

@inproceedings{ac99608d69c04df1ba45c000a13d712d,

title = "Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties",

abstract = "Nano-metal sintering is a promising technology for the next generation of semiconductor packaging due to its positive effect on reliability enhancement. Compared with the silver sintering, copper-based sintering technique has more potential to be applied in die attachment field as its superiorities on lower cost, higher melting temperature without electromigration. In this study, Taguchi method is applied to study and analyze the effect of nano-/micro- particle ratio on sintering properties. Sintering temperature is also taken into account since it depends on the particle size a lot. The results show that both sintering temperature and nano-micro- ratio play significant role on influencing shear strength. The best combination is 300 nm with 1 um mixing (1:1) with over 35 MPa shear strength with 300°C sintering temperature. The fracture surface result shows that the crack propagated in the sintering body. Furthermore, the cross-section inspection reveals dense bonding and clearly sintering necking, and the porosity is lower than 12%. 227.8 W/m*K thermal conductivity and 6.0 uΩ·cm electrical resistivity are measured for the sample, which indicates the great potential for the packaging application in high power situation.",

keywords = "Nano copper, sintering technology",

author = "X. Liu and Quan Zhou and Qipeng Liu and Honghao Tang and Chenshan Gao and Bin Xie and Koh, {Sau Wee} and Huaiyu Ye and Guoqi Zhang",

year = "2020",

doi = "10.1109/ICEPT50128.2020.9201937",

language = "English",

isbn = "978-1-7281-6827-2",

pages = "1--5",

booktitle = "2020 21st International Conference on Electronic Packaging Technology (ICEPT)",

publisher = "IEEE",

address = "United States",

note = "21st International Conference on Electronic Packaging Technology, ICEPT 2020 ; Conference date: 12-08-2020 Through 15-08-2020",

}

Liu, X, Zhou, Q, Liu, Q, Tang, H, Gao, C, Xie, B, Koh, SW, Ye, H & Zhang, G 2020, Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties. in 2020 21st International Conference on Electronic Packaging Technology (ICEPT): Proceedings. IEEE, pp. 1-5, 21st International Conference on Electronic Packaging Technology, ICEPT 2020, Guangzhou, China, 12/08/20. https://doi.org/10.1109/ICEPT50128.2020.9201937

Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties. / Liu, X.; Zhou, Quan; Liu, Qipeng et al.
2020 21st International Conference on Electronic Packaging Technology (ICEPT): Proceedings. IEEE, 2020. p. 1-5.

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties

AU - Liu, X.

AU - Zhou, Quan

AU - Liu, Qipeng

AU - Tang, Honghao

AU - Gao, Chenshan

AU - Xie, Bin

AU - Koh, Sau Wee

AU - Ye, Huaiyu

AU - Zhang, Guoqi

PY - 2020

Y1 - 2020

N2 - Nano-metal sintering is a promising technology for the next generation of semiconductor packaging due to its positive effect on reliability enhancement. Compared with the silver sintering, copper-based sintering technique has more potential to be applied in die attachment field as its superiorities on lower cost, higher melting temperature without electromigration. In this study, Taguchi method is applied to study and analyze the effect of nano-/micro- particle ratio on sintering properties. Sintering temperature is also taken into account since it depends on the particle size a lot. The results show that both sintering temperature and nano-micro- ratio play significant role on influencing shear strength. The best combination is 300 nm with 1 um mixing (1:1) with over 35 MPa shear strength with 300°C sintering temperature. The fracture surface result shows that the crack propagated in the sintering body. Furthermore, the cross-section inspection reveals dense bonding and clearly sintering necking, and the porosity is lower than 12%. 227.8 W/m*K thermal conductivity and 6.0 uΩ·cm electrical resistivity are measured for the sample, which indicates the great potential for the packaging application in high power situation.

AB - Nano-metal sintering is a promising technology for the next generation of semiconductor packaging due to its positive effect on reliability enhancement. Compared with the silver sintering, copper-based sintering technique has more potential to be applied in die attachment field as its superiorities on lower cost, higher melting temperature without electromigration. In this study, Taguchi method is applied to study and analyze the effect of nano-/micro- particle ratio on sintering properties. Sintering temperature is also taken into account since it depends on the particle size a lot. The results show that both sintering temperature and nano-micro- ratio play significant role on influencing shear strength. The best combination is 300 nm with 1 um mixing (1:1) with over 35 MPa shear strength with 300°C sintering temperature. The fracture surface result shows that the crack propagated in the sintering body. Furthermore, the cross-section inspection reveals dense bonding and clearly sintering necking, and the porosity is lower than 12%. 227.8 W/m*K thermal conductivity and 6.0 uΩ·cm electrical resistivity are measured for the sample, which indicates the great potential for the packaging application in high power situation.

KW - Nano copper

KW - sintering technology

UR - http://www.scopus.com/inward/record.url?scp=85093363006&partnerID=8YFLogxK

U2 - 10.1109/ICEPT50128.2020.9201937

DO - 10.1109/ICEPT50128.2020.9201937

M3 - Conference contribution

SN - 978-1-7281-6827-2

SP - 1

EP - 5

BT - 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

PB - IEEE

T2 - 21st International Conference on Electronic Packaging Technology, ICEPT 2020

Y2 - 12 August 2020 through 15 August 2020

ER -

Study on the effect of mixing proportion of micro- and nano-copper particles on sintering properties

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