Substrate thinning and trenching as crosstalk suppression techniques

SM Sinaga; A Polyakov; M Bartek; JN Burghartz

Substrate thinning and trenching as crosstalk suppression techniques

SM Sinaga, A Polyakov, M Bartek, JN Burghartz

Research output: Chapter in Book/Conference proceedings/Edited volume › Conference contribution › Scientific › peer-review

Original language	Undefined/Unknown
Title of host publication	Proceedings, European Microelectronics and Packaging Symposium
Place of Publication	Prague
Publisher	IMAPS CZ&SK
Pages	131-136
Number of pages	6
ISBN (Print)	80-239-2835-X
Publication status	Published - 2004
Event	European Microelectronics and Packaging Symposium, Prague, Czech Republic - Prague Duration: 16 Jun 2004 → 18 Jun 2004

Publication series

Name
Publisher	IMAPS CZ&SK

Conference

Conference	European Microelectronics and Packaging Symposium, Prague, Czech Republic
Period	16/06/04 → 18/06/04

Bibliographical note

ed. is niet bekend

Keywords

conference contrib. refereed
Conf.proc. > 3 pag

Cite this

@inproceedings{c7ad110ffd2046239e2ff09b8925b243,

title = "Substrate thinning and trenching as crosstalk suppression techniques",

keywords = "conference contrib. refereed, Conf.proc. > 3 pag",

author = "SM Sinaga and A Polyakov and M Bartek and JN Burghartz",

note = "ed. is niet bekend; European Microelectronics and Packaging Symposium, Prague, Czech Republic ; Conference date: 16-06-2004 Through 18-06-2004",

year = "2004",

language = "Undefined/Unknown",

isbn = "80-239-2835-X",

publisher = "IMAPS CZ&SK",

pages = "131--136",

booktitle = "Proceedings, European Microelectronics and Packaging Symposium",

}

TY - GEN

T1 - Substrate thinning and trenching as crosstalk suppression techniques

AU - Sinaga, SM

AU - Polyakov, A

AU - Bartek, M

AU - Burghartz, JN

N1 - ed. is niet bekend

PY - 2004

Y1 - 2004

KW - conference contrib. refereed

KW - Conf.proc. > 3 pag

M3 - Conference contribution

SN - 80-239-2835-X

SP - 131

EP - 136

BT - Proceedings, European Microelectronics and Packaging Symposium

PB - IMAPS CZ&SK

CY - Prague

T2 - European Microelectronics and Packaging Symposium, Prague, Czech Republic

Y2 - 16 June 2004 through 18 June 2004

ER -