Substrate Transfer Technology for Stretchable Electronics

Shivani Joshi, Angel Savov, Ronald Dekker

Research output: Contribution to journalConference articleScientificpeer-review

7 Citations (Scopus)
50 Downloads (Pure)


This paper focuses on the implementation of a new technique for the fabrication of stretchable electronic patches that can be used for medical applications. The technique is based on the Electronics on Plastics by Laser Release (EPlaR) technology which enables a one-step release of a stack of flexible/stretchable layers incorporating the active layers like interconnects and embedded devices. As a proof of concept meander shaped polyimide (PI) structures are fabricated on top of a glass substrate and then transferred to a PDMS substrate with the use of this technology. The stretchability in the device is enhanced by fabricating these meander shaped structures free from the PDMS substrate hence giving them the freedom to move out of plane.
Original languageEnglish
Pages (from-to)1555-1558
Number of pages4
JournalProcedia Engineering
Publication statusPublished - 2016
EventEurosensors 2016: The 30th anniversary Eurosensors Conference - Budapest, Hungary
Duration: 4 Sep 20167 Sep 2016


  • substrate transfer
  • flexible
  • stretchable
  • body patches
  • ultrasound


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