System in package (SiP) technology: Fundamentals, design and applications

Fabio Santagata, Jianwen Sun, Elina Iervolino, Hongyu Yu, Fei Wang, Guoqi Zhang, P.M. Sarro, Guoyi Zhang

Research output: Contribution to journalArticleScientific

6 Citations (Scopus)


Purpose: The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper. Design/methodology/approach: The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing. Findings: In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system. Originality/value: SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

Original languageEnglish
Pages (from-to)231-243
Number of pages13
JournalMicroelectronics International
Issue number4
Publication statusPublished - 2018


  • Gas sensor system
  • LED module
  • PM sensor
  • System-in-package (SiP)


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