System in package (SiP) technology: Fundamentals, design and applications

Fabio Santagata*, Jianwen Sun, Elina Iervolino, Hongyu Yu, Fei Wang, Guoqi Zhang, P.M. Sarro, Guoyi Zhang

*Corresponding author for this work

Research output: Contribution to journalArticleScientific

15 Citations (Scopus)
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Material Science

Engineering

Computer Science