System in package (SiP) technology: Fundamentals, design and applications

Fabio Santagata*, Jianwen Sun, Elina Iervolino, Hongyu Yu, Fei Wang, Guoqi Zhang, P.M. Sarro, Guoyi Zhang

*Corresponding author for this work

Research output: Contribution to journal › Article › Scientific

17 Citations (Scopus)
74 Downloads (Pure)

Fingerprint

Dive into the research topics of 'System in package (SiP) technology: Fundamentals, design and applications'. Together they form a unique fingerprint.

INIS

Engineering

Computer Science

Keyphrases

Material Science