System Software Reliability

Willem D. van Driel, J.W. Bikker, M. Tijink

Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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Abstract

It is known that quantitative measures for the reliability of software systems can be derived from software reliability models. And, as such, support the product development process. Over the past four decades, research activities in this area have been performed. As a result, many software reliability models have been proposed. It was shown that, once these models reach a certain level of convergence, it can enable the developer to release the software. And stop software testing accordingly. Criteria to determine the optimal testing time include the number of remaining errors, failure rate, reliability requirements, or total system cost. In this paper we will present our results in predicting the reliability of software for agile testing environments. We seek to model this way of working by extending the Jelinski-Moranda model to a 'stack' of feature-specific models, assuming that the bugs are labelled with the feature they belong to. In order to demonstrate the extended model, several prediction results of actual cases will be presented. The questions to be answered in these cases are: how many software bugs remain in the software and should one decide to stop testing the software?

Original languageEnglish
Title of host publication 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Subtitle of host publicationProceedings
PublisherIEEE
Pages1-5
Number of pages5
ISBN (Electronic)978-1-7281-6049-8
ISBN (Print)978-1-7281-6050-4
DOIs
Publication statusPublished - 2020
Event21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020 - Cracow, Poland
Duration: 5 Jul 20208 Jul 2020

Conference

Conference21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020
CountryPoland
CityCracow
Period5/07/208/07/20

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